MaAnt C1 Magnetic BGA Reballing Platform with steel mesh for iPhone A8-A18 Pro CPU, HUAWEI, Qualcomm, EMMC, MTK, Hisilicon Snapdragon, Samsung CPU soldering repair. MaAnt C1 magnetodynamic tin planting platform for iPhone and Android Phones repair.
Features:
1. Support iPhone CPU, Hisilicon CPU, Qualcomm CPU, ect.
2. Strong magnetic adsorption, simple operation, precise positioning, imported synthetic stone, thermostability, antistatic.
3. New magnetic dynamic original positioning strong magnetic force automatic clamping, convenient and flexible, supporting a variety of CPU maintenance positioning and firm clamping.
Support models:
1. For iPhone 6-16 Pro Max CPU.(A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18 Pro）
2. For Hisilicon CPU.(Huawei hisilicon series: hisilicon 810, hisilicon 820, hisilicon 990, hisilicon 710, hisilicon 970, hisilicon 980, hisilicon 9000, hisilicon 960, hisilicon 985.)
3. For Qualcomm CPU.(Snapdragon 888, Snapdragon 865 small, Snapdragon 865 large, Snapdragon 855, Snapdragon 765G, Snapdragon 778, Snapdragon 845.)
