MaAnt C1 Magnetic BGA Reballing Platform with steel mesh for iPhone A8-A19 Pro CPU, HUAWEI, Qualcomm, EMMC, MTK, Hisilicon Snapdragon, Samsung CPU soldering repair. MaAnt C1 magnetodynamic tin planting platform for iPhone and Android Phones repair.
Features:
1. Support iPhone 6-17 Pro Max CPU A8-A19 Pro, Hisilicon CPU, Qualcomm CPU, MTK, Samsung CPU, EMMC, etc.
2. Strong magnetic adsorption, simple operation, precise positioning, imported synthetic stone, thermostability, antistatic.
3. New magnetic dynamic original positioning strong magnetic force automatic clamping, convenient and flexible, supporting a variety of CPU maintenance positioning and firm clamping.
Support models:
1. For iPhone 6-17 Pro Max CPU: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17, A18 Pro, A19 Pro.
2. For Hisilicon CPU: Huawei hisilicon series: hisilicon 960, hisilicon 820/985, hisilicon 970, Kirin 9000, Kirin 9000S, hisilicon 810, hisilicon 710, hisilicon 990, hisilicon 980, Kirin 9020.
3. For Qualcomm CPU: Snapdragon 7 Gen3, Gen 1, Snapdragon 8, Gen3, Snapdragon 865 big/870 big, Snapdragon 888/888 Plus, Snapdragon 855, Snapdragon 845, Snapdragon 750G, Snapdragon 765G, Snapdragon 865 small/870, Snapdragon 778G, Snapdragon 8+ sm8475, Snapdragon 8 Gen 2 SM8550.
4. For Mediatek MTK CPU: MTK 9000, MTK 900, MTK 800, MTK 100/1200, MTK 930, MTK 810, MTK 720, MTK 1000, MTK 9200, MTK 8100, MTK 9300.
5. For Samsung CPU: Exynos 2200, Exynos 9820, Exynos 990, Exynos 8895, Exynos 9815/1080, Exynos 980, Exynos 2100,
6. For EMMC Font: BGA221, BGA162, BGA134, BGA178 small, BGA153, BGA254 small, Hisilicon Qualcomm RAM, BGA169, BGA86.
