2UUL BH12 THE ONE PLATE Magnetic Reballing Platform with Curved Silicone Pad is compatible with most BGA reballing stencils and can be used for soldering and repairing various mobile phone chips, PCB mid-layer frames, computer chips, ECU chips, etc. High-temperature resistance, unique curved surface, strong magnetic force ensures a tight fit between the stencil and the platform, making it suitable for chip placement, welding, and repair.
Features:
1. Strong Magnetic Force: Extensive magnetic force ensures a firm fit between the stencil and the platform, improving operational stability.
2. Curved Surface Design: Precise curved surface design ensures a seamless fit with the stencil, guaranteeing accurate chip placement.
3. High Temperature Resistance: High-temperature resistant materials allow it to withstand the high-temperature environment during welding, ensuring long-term stable operation.
4. Wide Compatibility: Suitable for 2UUL series and universally compatible stencils, such as Phone17 T0.12, HI36A0 Hisilicon Kirin 9000S T0.12, etc.
Product Parameters:
Name: BH12 THE ONE PLATE Magnetic Curved Reballing Platform with Silicone Pad
Net Weight: 155g
Gross Weight: 161g
Package Size: 64mm×85mm×15mm
Product Size: 62mm×82mm×11mm
