2UUL BH16 NANDREBALL BASE Magnetic Dual-Sided Platform with BGA110 BGA315 Reballing Stencil for iPhone 8-17 Pro Max/iPad Nand Flash Chip Repair. Strong magnetic adsorption ensures the Nand memory chip is securely placed during the soldering process. Suitable for iPhone 8-17 Pro Max and iPad BGA110 BGA315 series chips, providing precise Nand flash chip reballing.
Feature:
1. Dual-sided soldering design: Available in BGA110 and BGA350 specifications to meet the needs of different devices.
2. Strong magnetism: Built-in strong magnetic design ensures secure chip fixation and prevents displacement during soldering.
3. Precise Compatibility: BGA110 is compatible with iPhone 8-13 series and iPad 10.2 (2022); BGA350 is compatible with iPhone 14-16 series and iPad Air (5th generation).
4. Ergonomic Design: Ergonomic user interface enhances operating comfort and work efficiency.
5. Multi-Specification Support: Flexible adjustment of the soldering area adapts to various iPhone and iPad models, meeting repair needs.
6. Compact and Convenient: Simple design, easy to store and carry, suitable for various working environments.
7. High-Precision Soldering: Provides a stable platform, ensuring precise BGA soldering operations, suitable for high-precision repair.
Product Parameters:
Name: BH16 NANDREBALL BASE Magnetic Dual-Sided Reballing Platform Set for IP Series NAND Flash
Net Weight: 74g
Gross Weight: 81g
Product Dimensions: 62x62x9.5mm
Packaging Dimensions: 65x65x11.5mm
