2UUL BH17 CPUREBALL BASE Magnetic Dual-sided Reballing Platform with A10-A19 Pro Exynos Qualcomm MTK Hisilicon EMMC RAM Stencil for iPhone 7-17 Pro Max and Android Phone repair. Double-sided solder balls, two thicknesses, with built-in strong magnets, allow for quick and precise CPU installation, ensuring no displacement during soldering. Suitable for repairing various mobile phone CPUs.
Feature:
1. Double-sided solder ball design: Supports two different solder ball sizes simultaneously, suitable for repairing CPUs in both Apple and Android devices.
2. Two thickness options: Offers two solder ball thicknesses: T0.6 (for Apple devices) and T0.35 (for Android devices), meeting the soldering requirements of different CPU models.
3. Strong magnets: Built-in strong magnets ensure stable CPU fixation and prevent displacement during soldering.
4. Precision Soldering: Provides a precise soldering platform, ensuring even distribution of solder balls and perfect CPU alignment.
5. Wide Applicability: Particularly suitable for multiple mainstream mobile phone CPU models such as the SM8750 Snapdragon 8 Ultra, A19 Pro, and A19.
6. Compact and Convenient: Compact design, suitable for use by repair personnel in limited spaces, easy to carry and store.
CPU stencil models (75pcs):
1. For iPhone 7-17 Pro Max (12pcs):
- A19 Pro
- A19
- A18 Pro
- A18
- A17
- A16
- A15
- A14
- A13
- A12
- A11
- A10
2. Qualcomm series (17pcs):
- SM8750
- SM8450
- SM8150
- SM7325
- SM7125
- SM8650
- SM8350
- SM7550
- SM7250
- SM8550
- SM7150
- SM7450
- SM8475/SM7475
- SM8250-102
- SM7350
- SM8250-002
- SM7225-00AB
3. HiSilicon series (9pcs):
- Hi36C0
- Hi36A0
- Hi3690-5G
- Hi3690-4G
- Hi3680
- Hi6280
- Hi6290/L
- Hi3640
- Hi3670
4. Exynos series (11pcs):
- Exynos 2200
- Exynos 2100
- Exynos 9820
- Exynos 980
- Exynos 8895
- Exynos 1480-E8845
- Exynos 1330-E8535P
- Exynos 990
- Exynos 1380-E8835P
- Exynos 1280-E8825
- Exynos 9815/1080
5. MTK series (14pcs):
- MT6989W
- MT6985W
- MT6895Z
- MT6897Z
- MT6855V
- MT6877V
- MT6853V
- MT8781/MT6789V
- MT6983Z
- MT6761V/6762V/6765
- MT6885Z
- MT6833V
- MT6873V/6875V
- MT6891Z/6893Z
6. EMMC+RAM series (12pcs):
- BGA 254
- BGA 186
- BGA 169
- BGA 162
- BGA 134
- BGA 556
- BGA 436
- BGA 376
- BGA 178
- BGA 496
- BGA 153
- BGA 221
Product Parameters:
Product Name: BH17 CPUREBALL BASE Magnetic Dual-Sided Reballing Platform Set for Phone CPU
Gross Weight: 266g
Net Weight: 238g
Product Dimensions: 58x58x11mm
Packaging Dimensions: 64.5x64.5x34.5mm
