2UUL BS148 BS183 Black Skull 148℃ 183℃ Solder Paste for Mobile Phone Repair. Such as cell phone motherboard repair, PCB BGA chip soldering repair, solder joint welding etc.
Option:
1. 2UUL BS148 148℃ solder paste 50G.
2. 2UUL BS183 183℃ solder paste 50G.
Features:
1. No false solder joints.
2. Golden ratio tin powder.
3. Super full, 0 bubbles.
4. Available in 148℃ 183℃.
Please note that this solder paste can only be shipped via special post mail.
