2UUL FS158 FS183 FS200 JOINT X Solder Paste 158℃ 183℃ 200℃ Tin Paste for mobile phone repair, iPhone middle layer tin planting, Phone CPU soldering and other IC chips welding repair.
Option:
1. 2UUL FS158 Solder Paste 158℃ 50g.
2. 2UUL FS183 Solder Paste 183℃ 50g.
3. 2UUL FS200 Solder Paste 200℃ 50g.
Features:
1. Multiple Temperature Options: Available in three melting points of 158°C, 183°C, and 200°C, it adapts to various repair scenarios, perfect solder joints.
2. High-Quality Ingredients: The solder paste contains silver to ensure soldering quality and high reliability.
3. Large Capacity: Each bottle weighs 50g, reducing frequent replacements and providing excellent value.
4. Ease of Use: Easy to use, suitable for soldering small and medium-sized chips and high-precision soldering.
5. Mid-Layer Soldering: Suitable for soldering at 158°C, suitable for soldering mid-layer components.
6. CPU Repair: 200°C melting point solder paste is particularly suitable for repairing and soldering high-temperature sensitive components such as CPUs.
7. Small and Medium-Sized Chip Soldering: 183°C melting point solder paste is suitable for soldering small and medium-sized chips, ensuring excellent soldering quality and stability.
Specifications:
Product Name: JOINT X Solder Paste for Phone Repair
Product Code: FS158/FS183/FS200
Dimensions: 175x130x40mm
Gross Weight: 1048.5g
Net Weight: 50.4g
