2UUL PadBall Solder Balls for Solder Pad Rework Repair. 2UUL PadBall Solder balls Sn63/Pb37 high conductivity for soldering missing solder joints on iPhone and Android Phones motherboard solder pad. Uniform size solder balls can quickly repair the missing solder joints on the mobile phone motherboard circuit board, effectively improving the efficiency of mobile phone repair.
Option (100000 pcs/bottle):
1. 2UUL PB01 PadBall Solder Balls for iPhone Solder Pad Rework.
2. 2UUL PB02 PadBall Solder Balls for Android Solder Pad Rework.
Please note that the solder balls can only be sent out by special way (post mail).
Product Parameters:
Product Name: PadBall--Solder Balls for Solder Pad Rework
Product Code: PB01 PadBall Solder Balls for iPhone Solder Pad Rework
PB02 PadBall Solder Balls for Android Solder Pad Rework
Packing Size: 131mmx 105mm x 48mm
Product Size: 16mm x 16mm x 32 mm
Net Weght: Android 7.2g/iPhone 5.5g
Gross Weght: Android 190g/iPhone 160g
