36pcs BGA reballing stencils kit steel mesh for Android mobile phone motherboard soldering reapir, phone soldering directly heated template, 36pcs universal BGA reballing solder rework stencils directly heat set, BGA reballing stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC chips, large set of common need in BGA working
36Pcs BGA Reballing Stencil Template Reballing Rework Net For Mobile Phone Motherboard Soldering Repair Tool 36pcs List :
- 1pcs universal Reballing Stencil 0.30mm (pitch 0.58mm) - 29*29
- 1pcs universal Reballing Stencil 0.35mm (pitch 0.65mm) - 29*29
- 1pcs universal Reballing Stencil 0.40mm(pitch 0.70mm) - 35.4*35.4
- 1pcs universal Reballing Stencil 0.45mm(pitch 0.78mm) - 35.4*35.4
- 1pcs universal Reballing Stencil 0.5mm(pitch 0.80mm) - 30.9*29.4
- 1pcs universal Reballing Stencil 0.6mm(pitch 0.90mm) - 45.4*45.5
- 1pcs universal Reballing Stencil 0.6mm(pitch 1.0mm) - 45.4*45.4
- 1pcs universal Reballing Stencil 0.6mm(pitch 1.1mm) - 31.9*31.9
- 1pcs universal Reballing Stencil 0.76mm(pitch 1.27mm) - 50.0*50.0
- 1pcs universal Reballing Stencil 0.5mm(pitch 0.78mm) - 35*35
- 1pcs universal Reballing Stencil 0.5mm(pitch 0.81mm) - 40*40
- 1pcs universal Reballing Stencil 0.55mm(pitch 1.02mm) - 50.6*50.6
- 1pcs universal Reballing Stencil 0.6mm(pitch 0.99mm) - 24*24
- 1pcs universal Reballing Stencil 0.6mm(pitch 0.99mm) - 27*27
- 1pcs universal Reballing Stencil 0.6mm(pitch 0.99mm) - 30*30
- 1pcs universal Reballing Stencil 0.6mm(pitch 0.99mm) - 33*33
- 1pcs universal Reballing Stencil 0.6mm(pitch 1.01mm) - 41*41
- 1pcs universal Reballing Stencil 0.65mm(pitch 1.0mm) - 47.6*47.6
- 1pcs universal Reballing Stencil 0.76mm(pitch 1.27mm) - 30*30
- 1pcs universal Reballing Stencil 0.76mm(pitch 1.27mm) - 33*33
- 1pcs universal Reballing Stencil 0.76mm(pitch 1.27mm) - 34*34
- 1pcs universal Reballing Stencil 0.76mm(pitch 1.27mm) - 37*37
- 1pcs universal Reballing Stencil 0.76mm(pitch 1.27mm) - 41*41
- 1pcs universal Reballing Stencil 1.00mm(pitch 1.5mm) - 48.5*48.5
- 1pcs universal Reballing Stencil 0.25mm(pitch 0.5mm) - 35.3*35.3
- 1pcs universal Reballing Stencil 0.30mm(pitch 0.5mm) - 35.3*35.4
- 1pcs universal Reballing Stencil 0.35mm(pitch 0.6mm) - 35.5*35.5
Product Features :
- 100% new brand and high quality.
- Super thin thickness, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Steel
- Color: As Pictures Show
- Application: For phone BGA reballing soldering repair
- Suitable for: For general rework station
- Function: For phone CPU BGA reballing
Package includes :
- 36pcs x BGA Reballing Stencil
