Amaoe IP17 A19 BGA Reballing Stencil for iPhone 17/17 Air/17 Pro/17 Pro Max motherboard CPU Nand and other IC soldering repair. Amaoe iPhone 17/Air/17 Pro Max middle layer reballing platform with BGA stencil steel mesh for iPhone 17/17 Pro Max motherboard middle frame soldering and repair.
Option:
1. Amaoe IP17 A19/A19 PRO Reballing Stencil: comprehensive reballing stencil for iPhone 17/17 Air/17 Pro/17 Pro Max.
2. Amaoe IP17A-012 mid-layer stencil: for iPhone 17 Air middle layer frame soldering.
3. Amaoe IP17PM-012 reballing stencil: for iPhone 17 Pro Max middle layer frame soldering.
4. Amaoe IP17P-012 middle layer reballing stencil: for iPhone 17 Pro middle layer frame soldering.
5. Amaoe A19 CPU lower layer reballing stencil.
6. Amaoe A19Pro CPU lower layer reballing stencil.
7. Amaoe IP17-012 reballing stencil: for iPhone 17 middle layer frame soldering.
8. AMAOE IP17 3-in-1 middle layer reballing platfomr with mid-frame stencil for iPhone 17/17 Pro/17 Pro Max (0.12mm).
9. AMAOE X-17 31-in-1 middle layer reballing platfomr with mid-frame stencil for iPhone X-17 Pro Max (0.12mm/0.1mm/0.08mm).
