SM8250 SM8150 RAM BGA Stencil 855 Upper Layer IC Reballing Pins Solder Tin Plant Net Amaoe Square Hole.Amaoe High Quality BGA Reballing Stencil for Qualcomm SDM439 CPU Steel mesh 0.12mm With Magnetism.
SM8250 CPU Bottom Layer BGA Stencil Reballing IC Pin Soldering Tin Plant Net Heating Template 0.12mm Thickness Anti Drum-up.
Option:
option 1: SDM439
option 2: SM8250 upper-0.12MM
option 3: SM8250 lower-0.12MM
option 4: SM8250 102-AA
option 5: SM8150 upper
option 6: SM8150 lower
