AMAOE IP18 A20/A20Pro BGA Reballing Stencil for iPhone 18 Pro/18 Pro Max/Duo IC and middle layer soldering and repair. 0.12mm precision and strong magnetic design. Compatible with A20Pro CPU lower layer, A20 chip, iPhone 18Pro/18ProMax middle layer and logic board repair. Covering critical repair points on iPhone 18 series and foldable Duo models. Ideal for professional repair technicians, this stencil set streamlines CPU and logic board reballing with precision and efficiency.
Option:
1. AMAOE IP18-A20/A20Pro stencil for iPhone 18Pro/18ProMax/Duo, 0.12mm.
2. AMAOE IP18Pro/18ProMax Middle layer stencil, 0.12mm.
3. AMAOE A20Pro CPU lower layer, 0.12MM.
Features:
1. 0.12mm Precision Stencils. Ultra-thin thickness ensures accurate, uniform solder ball placement.
2. Strong Magnetic Design. Securely locks stencil and chip in place for stable alignment during rework.
3. Heat Dissipation Hole Design. Prevents solder bulging and ensures consistent reballing results.
4. A20Pro CPU Lower Layer Stencil. Specifically designed for the A20Pro chip's lower layer reballing.
5. A20 Chip Stencil. Dedicated stencil for A20 chip reballing and repair.
6. IP18Pro/18ProMax Middle Layer Stencil. Precise stencil for iPhone 18 Pro/Pro Max motherboard middle layer.
7. Compatible with iPhone 18 Series & iPhone Duo. Covers iPhone 18 Pro/18 Pro Max and iPhone Duo models for comprehensive repair support.
