Amaoe HWB1 HWB2 HWB3 BGA Reballing Stencil for Huawei Honor Small Boards and Font DDR Adapter Board Soldering Repair. Amaoe HWB series steel mesh uses ultra-hard stencil material and features a heat dissipation hole design to prevent bulging, ensuring high efficiency, stability, and quality during soldering. Suitable for high-precision BGA repair work, especially for repairing motherboards and small boards of various Huawei P series, Mate series, and Honor series mobile phones.
Option:
1. AMAOE HWB1 0.12mm reballing stencil: for P30/MT30/V30/P40 series/MT40 series.
2. AMAOE HWB2 0.12mm reballing stencil: for Mate70 small board, Pura70 small board, Mate50 Pro small board, Mate40 RS Porsche Design camera small board, P50P display small board, Honor Magic3 Pro RF/small camera small board, Pura70 Pro/70 Pro+ small board.
3. AMAOE HWB3 0.15mm reballing stencil: for BGA284, BGA153, BGA200, BGA284, BGA297, BGA254, BGA242, BGA336.
Features:
1. Uses ultra-hard stencil material to ensure wear resistance during long-term use.
2. Heat dissipation hole design to prevent bulging during soldering, effectively avoiding bulging problems and improving soldering results.
3. Customized mesh size for Huawei Honor motherboards and small boards, providing precise soldering support.
4. High-precision mesh design ensures error-free soldering, improving repair efficiency and soldering quality.
5. Specially designed mesh adapted for Huawei DDR adapter boards to meet different needs.
