AMAOE IP18 Middle Layer Reballing Platform for iPhone 18 Pro/18 Pro Max Mid-frame soldering and repair. 0.08/0.1/0.12mm precision and strong magnetic design. Compatible with iPhone 18 Pro/18 Pro Max motherboard middle layer logic board repair. Covering critical repair points on iPhone 18 Pro series. Ideal for professional repair technicians, this stencil set streamlines CPU and logic board reballing with precision and efficiency.
Option:
1. AMAOE IP18Pro/18ProMax Middle layer reballing stencil, 0.1mm, 0.08mm, 0.12mm.
2. AMAOE IP18Pro/18ProMax middle layer reballing platform set.
Features:
1. 0.12mm/0.08mm/0.1mm Precision Stencils. Ultra-thin thickness ensures accurate, uniform solder ball placement.
2. Strong Magnetic Design. Securely locks stencil and chip in place for stable alignment during rework.
3. Heat Dissipation Hole Design. Prevents solder bulging and ensures consistent reballing results.
4. IP18Pro/18ProMax Middle Layer Stencil. Precise stencil for iPhone 18 Pro/Pro Max motherboard middle layer.
