AMAOE iPhone Duo Touch IC 3-in-1 Reballing Platform Set is a professional-grade tool kit designed specifically for repairing the touch IC on foldable iPhone Duo screens. This comprehensive set includes a 0.12mm precision reballing stencil, a magnetic base, a positioning plate, and a tin scraping blade — everything needed for accurate, efficient BGA reballing. Ideal for phone repair technicians working on iPhone Duo (foldable) models, this 3-in-1 kit streamlines the touch IC reballing process and delivers consistent, professional results.
Features:
1. 3-in-1 Complete Kit. Includes 0.12mm stencil, magnetic base, positioning plate, and tin scraping blade, everything needed for touch IC reballing.
2. 0.12mm Precision Stencil. Ultra-thin 0.12mm thickness ensures accurate, uniform solder ball placement.
3. Heat Dissipation Hole Design. Prevents solder bulging and ensures consistent reballing results
4. Magnetic Base & Positioning Plate. Strong magnetic attraction locks the stencil and chip in place for precise alignment.
5. Tin Scraping Blade Included. Efficiently spread and level solder paste for clean, uniform application.
6. Designed for iPhone Duo (Foldable) Specifically engineered for the foldable iPhone screen touch IC, precise fit and compatibility.
7. Durable Construction. High-quality materials withstand repeated high-temperature soldering cycles.
