AMAOE OFix-A AFix-B universal PCB holder fixture for mobile phone motherboard soldering repair. Amaoe AFix-B Mini Glue Removal Platform CPU IC Chip Fixture for Mobile Phone Repair. Amaoe OFix-A multifunctional repair fixture for motherboard CPU IC glue removal soldering repair.
Option:
1. AMAOE OFix-A fixture.
2. AMAOE AFix-B fixture.
AFix-B Features:
1. Amoe AFix-B mini mobile phone repair platform, compatible with motherboard repair and chip disassembly repair 2-in-1 platform.
2. Hidden screws, a new design of detachable base.
3. The base is separated, leaving room for upgrades.
4. Hidden screws prevent residue from falling into the screws, making it more durable and more convenient to use.
5. Bilateral clamping, three-button positioning, suitable for various motherboards.
6. Can be used to remove glue after chip fixation, and can also be used for motherboard repair, especially for iPhone series motherboards.
7. Scope of application: ICs that need to be disassembled, such as some mobile phone motherboards, CPUs, hard drives, etc.
OFix-A Feature:
1. New design with hidden screw, separate base.
2. Add practical functions, add glue removal modules, backle inner groove design.
3. The base is separated, the upgrade space is reserved, and the new model will be released later to reduce the cost of purchasing the base.
4. Hidden screw, prevent residue from falling into the screw more durable and batter to use.
5. Add glue removal module to meet most chip glue removal, convenient, practical and fast.
6. Shallow inner slot buckle design, the cart board will not pop out, and then capacitor resistance will not be stuck.
7. Diversified buckle design.
8. size: 130*100*24mm.
