Amaoe Qualcomm CPU Baseband 0.12MM BGA Reballing Stencil Tin Planting Net QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8 QU9. Amaoe QU series BGA Reballing Stencil for Qualcomm CPU Snapdragon IC Reballing.
Option:
QU:1 stencil: For Qualcomm CPU MSM8996 B, MSM8976 B, MSM8992 B, MSM8996 A, MSM8976 A, MSM8992 A.
QU:2 stencil: For Qualcomm CPU MSM8953 B01, MSM8937, MSM8998 B, MSM8953 1AB, MSM8916, MSM8998 A.
QU:3 stencil: For Qualcomm CPU MSM8953 B01, MSM8937, MSM8998 B, MSM8953 1AB, MSM8916, MSM8998 A.
QU:4 stencil: For Qualcomm CPU MSM8994 B, MSM8974 B, MSM8960 B, MSM8994 A, MSM8974 A, MSM8960 A.
QU:5 stencil: For Qualcomm CPU SDM845, SM8150, SDM670, MSM8917, SDM845 RAM, SM8150 RAM, SD710, SM6150.
QU:6 stencil: For Qualcomm CPU Baseband QSC6270, MDM9600, MSM6260, MSM7227, QSC1110, MDM6600, MSM6246, MSM8909W, QSC1105, MDM8215, MDM9215M, MSM7521.
QU:7 stencil: For Qualcomm CPU Snapdragon 460-SM4250, 665-SM6125, 662-SM6115, 720G-SM7125, 730G-SM7150, 750G-SM7225, 765G-SM7250, 775G-SM7350.
QU:8 stencil: For Qualcomm CPU SM8250-102 small, SM8250-102 large, SDM439, SM8250-102 RAM samll, SM8250-102 RAM large / SM8350 RAM, SM8350 Snapdragon 888.
QU:9 stencil: for Snapdragon SM8750, SM8635, SM8550, SM8450, SM8650, SM7475, SM8475, SM8425, SM7550, BGA496.
