AMAOE U-QSD1 to U-QSD12 BGA Reballing Stencil for Qualcomm Snapdragon CPU chip soldering repair, including SM7635 SM7550 SM6450 SM4450 SM8550 SM8635 SM8650 SM8350 SM8450 SM8475 SM8425 SM7475 SM7225 SM6350 SM8150 etc. AMAOE U-QSD series Qualcomm Snapdragon IC 0.12mm steel mesh.
Models:
AMAOE U-QSD1 reballing stencil: Qualcomm Snapdragon 800/801/808/650/652, MSM8274/8674/8974/8992/8856/8976 comprehensive steel mesh 0.12mm.
AMAOE U-QSD2 reballing stencil: Qualcomm Snapdragon 835/820, MSM8998/8996 comprehensive steel mesh 0.12mm.
AMAOE U-QSD3 reballing stencil: Qualcomm Snapdragon 410/615/210/617/439, MSM8916/8939/8909/8952/SDM439 comprehensive steel mesh 0.12mm.
AMAOE U-QSD4 reballing stencil: Qualcomm Snapdragon 625/430/435/425/632/450, MSM8953/8937/8940/8917/SDM632/450 comprehensive steel mesh 0.12mm.
AMAOE U-QSD5 reballing stencil: Qualcomm Snapdragon 665/675/660/636/670/710, SM6125/6150/SDM660/636/670/710 comprehensive steel mesh 0.12mm.
AMAOE U-QSD6 reballing stencil: Qualcomm Snapdragon 855/730/845, SM8150/7150/SDM845 comprehensive steel mesh 0.12mm.
AMAOE U-QSD7 reballing stencil: Qualcomm Snapdragon 750G/690/695/720G/460/662/765G, SM7225/6350/6375/4375/7125/4250/6115/7250 comprehensive steel mesh 0.12mm.
AMAOE U-QSD8 reballing stencil: Qualcomm Snapdragon 7 Gen1/680/775G/778G, SM7450/6225/7350/7315/7325 comprehensive steel mesh 0.12mm.
AMAOE U-QSD9 reballing stencil: Qualcomm Snapdragon 865/870, SM8250 comprehensive steel mesh 0.12mm.
AMAOE U-QSD10 reballing stencil: Qualcomm Snapdragon 888/8 Gen1/8+ Gen1/8+ 4G/7+ Gen2, SM8350/8450/8475/8425/7475 comprehensive steel mesh 0.12MM.
AMAOE U-QSD11 reballing stencil: Qualcomm Snapdragon 8 Gen2/8s Gen3/8 Gen3, SM8550/SM8635/SM8650 comprehensive steel mesh 0.12MM.
AMAOE U-QSD12 reballing stencil: Qualcomm Snapdragon 7s Gen3/7 Gen3/6 Gen1/4 Gen2, SM7635/SM7550/SM6450/SM4450 comprehensive steel mesh 0.12MM.
