AMTECH 10CC NC-559-ASM Solder Paste Flux BGA Lead-free Solder Paste For Mobile Phone PCB Soldering Repair.
Note: solder paste can only can be sent out by special mail post.
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.
- Excellent capacity of solder-stickiness
- Excellent Anti-wet Capacity
- Widely used on BGA, PGA, CSP packages and flip chip operation
- Suitable for multiple PCB reflow
- No-clean and Lead free for environmental protection
- Brand: AMTECH
- Flux Type: NC-559-ASM
- Volume: 10cc / bottle
- Color: Yellow
- Weight: 0.08kg
- 1pc x NC-559-ASM Solder Flux Solder Paste