Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template.
Features:
--High Quality Stainless Steel BGA Reballing Stencil.
--Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR
--Make your repair work easier.
--Color : Silver
--Feature : Square Hole
--We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.
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