BGA Reballing Stencil Kit Set For Samsung HUAWEI Xiaomi OPPO Meizu LG

Kaisi BGA Reballing Stencil Kit Set IC Power Chip For HUAWEI XIAOMI OPPO Meizu LG Samsung MTK High Quality Solder Template.

Features:
--High Quality Stainless Steel BGA Reballing Stencil.
--Specially Designed for HUAWEI XIAOMI LG OPPO MEIZU Samsung MTK MAX WTR
--Make your repair work easier.
--Color : Silver
--Feature : Square Hole 
--We promised all the plate boards are in Brand New condition,but this item is easy to get scratched.