DIYPHONE Multi-Purpose Mesh BGA Reballing Stencil for Samsung Exynos CPU EU:01-EU:05 IC Chip Solder Template. 0.12mm BGA Reballing Stencil For Samsung Exynos CPU RAM IC EU:01/EU:02/EU:03/EU:04 BGA Stencil Chip Solder Ball Reballing Pins Tin Plant Net. Samsung Exynos EU:05 CPU 0.15mm middle layer BGA Reballing Stencil glue removal& Tin Planting.
Option:
Samsung Exynos EU:01 For 3475/8895/9810/7570/3475/8895/7580/7880 0.12MM CPU BGA TIN Reballing Stencil Solder Template.
Samsung Exynos EU:02 For 7420/5430/8890B/7420/5430/8890A 0.12MM CPU BGA TIN Reballing Stencil Solder Template.
Samsung Exynos EU:03 For 2100B/1080B/0815/8895-1703/2100A/1080A/3830/9609 0.12MM CPU BGA TIN Reballing Stencil Solder Template.
Samsung Exynos EU:04 For 990B/880/980/9610B/9611B/7885B/990A/9820/9610A/9611A/7885A 0.12MM CPU BGA TIN Reballing Stencil Solder Template.
Samsung Exynos EU:05 For 9610RAM/7884/7885/7904RAM/5430RAM/8890RAM/7870/7880RAM/9611RAM 0.15MM CPU middle layer BGA Reballing Stencil Planting Tin Glue Removal Steel Mesh.
Features:
1. Brand New DIYPHONE BGA Reballing Stencil For SAMSUNG Exynos EU:01/EU:02/EU:03/EU:04/ EU:05.
2. Deformation resistant material.
3. Precise pins locatio.
Package includes:
1 x Samsung Exynos BGA Reballing Stencil
