Professional Lead-Free BGA Solder Flux Paste 138℃ / 183℃ / 217℃ Low Medium High Temperature Soldering Paste Flux for Mobile Phone Motherboard Welding Repair Tool.Optional Models:
1. Needle tube packaging:FIX-230 Sn42 / Bi58 42g
2. Canned package:FIX-231 Sn42 / Bi58 55g
- Medium Temperature (183℃):
1: Syringe packaging: Needle tube FIX-229 Sn62.8 / Pb8 / Ag0.4 42g
2: Canned packaging:FIX-228 Sn62.8 / Pb36.8 / Ag0.4 55g
1: Syringe packaging: Needle tube FIX-227 Sn96.5 / Ag3 / Cu0.5 42g
2: Canned packaging:FIX-226 Sn96.5 / Ag3 / Cu0.5 55g
Peculiarities:
- With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.
- Wettability and demould properties are good, anti-cold & hot collapse and anti-dry are strong.
- Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection tombstoning displacement phenomenon.
- Full tin and shinning tin beads, less residue, white and transparent, and there is no strong corrosive substance such as fluorine.
Package includes: 1pc x Lead-Free BGA Solder Flux Paste