i2C Mobile Phone Repair Blade Set All-Round Chip Repair Kit with high-temperature resistant solder blades for removing glue, scraping solder paste, and prying PCB BGA CPU Nand chips during phone repair or laptop repair. The ultra-thin blade and high-carbon steel construction ensure efficient repairs without damaging circuit boards and chips. The handle, made of aerospace-grade aluminum alloy, is robust and durable, suitable for various repair environments. It works even better when used with a hot air gun.
Features:
1. High-Temperature Resistance: Both the blades and handle are heat-resistant, suitable for environments up to 300°C.
2. Ultra-Thin Design: The blades are 0.1mm to 0.25mm thick, thin and resistant to deformation, suitable for delicate operations.
3. High-Carbon Steel Material: The blades are made of high-carbon steel with a finely ground surface, offering high wear resistance and corrosion resistance, maintaining excellent performance over long periods.
4. Flexibility and Toughness: The blades remain sharp even when bent, capable of handling complex chip disassembly tasks.
5. Replaceable Blades: Double cross-clamp design securely holds the blade, preventing wobbling, and allows for easy blade replacement.
6. Comfortable Handle: Two handle styles are available, made of aerospace-grade aluminum alloy, drop-resistant and wear-resistant, with a comfortable grip.
7. Multi-functional Use: Suitable for motherboard glue removal, solder scraping, IC/CPU prying, and other repair tasks.
Options:
1. Q1 handle + 4 blades
2. Q2 handle + 4 blades
3. Q1 + Q2 handle + 4 blades
Product Parameters
Brand: i2C
Material: Aluminum Alloy Handle / High Carbon Steel Blade
Name: All-Round Chip Repair Kit Q1 Version, Q2 Version, Q1 + Q2
Functions: Suitable for Motherboard Glue Removal, Tin Scraping, IC/CPU Prying, etc.
Package Weight: 54g/88.4g
