JCID All-in-One NAND Reballing Stencil is crafted from specially hardened steel with a thickness of 0.15mm. It is compatible with a wide range of Apple and Android storage chip packages—including NAND, eMMC, UFS, and PCIE—and features superior durability and precision-cut apertures, making it ideal for reballing (tin planting) repairs on iPhone NAND chips.
Features:
1. A single stencil integrates multiple mainstream NAND/eMMC/UFS/BGA package specifications, minimizing the need for frequent stencil changes and significantly boosting repair efficiency.
2. Compatible with reballing repairs for mainstream Apple and Android storage chips, offering a broader scope of application.
3. Precisely aligns with chip solder pad layouts, ensuring more uniform solder ball placement and effectively reducing issues such as bridging (solder shorts) and misalignment.
4. Constructed from specially hardened steel that is heat-resistant and highly resistant to deformation, making it suitable for frequent, long-term professional use.
5. Optimizes solder ball formation results, thereby enhancing soldering stability and increasing the success rate of chip reballing operations.
Supported Chips
The stencil integrates various mainstream storage chip package structures, primarily covering eMMC, UFS, NAND, and PCIE chips:
· UFS Series: UFS153/169/254/297
· eMMC Series: eMMC100/153/162/169/186
· BGA Series (General & Specialized Packages): BGA60, BGA70, BGA110, BGA315.
Product Specifications
Brand: JCID
Name: All-in-One NAND Reballing Stencil
Material: Specially Hardened Steel
Thickness: 0.15mm
Compatible Devices: Apple/Android
Compatible Chips: NAND/eMMC/UFS/PCIE
Function: Chip Reballing, BGA Rework, Storage Drive Repair
