JCID 2023X/2023/2020/2015 Precision Desoldering Braid is a 2.0mm width, low‑residue copper desoldering wire designed for phone motherboard repair, BGA rework, and PCB desoldering. Crafted from high-density, precision-braided oxygen-free copper, it offers superior thermal conductivity for fast, one-pass solder removal without damaging delicate pads or components. It's an essential tool for technicians repairing mobile phone motherboards, laptops, and precision electronic devices.
Option (5pcs/box):
JCID 2023X desoldering braid: (width: 2.0mm, length: 2.3m)
JCID 2023 desoldering braid: (width: 2.0mm, length: 2.3m)
JCID 2020 desoldering braid: (width: 2.0mm, length: 2.0m)
JCID 2015 desoldering braid: (width: 2.0mm, length: 1.5m)
Features:
1. Made of high-purity oxygen-free copper for excellent thermal conductivity-transfers heat instantly on contact to rapidly melt and wick away residual solder.
2. High-density tightly woven braid ensures fast and thorough solder absorption, outperforming conventional loose weaves.
3. Specially treated for enhanced flexibility and tear resistance-withstands repeated bending and pulling without fraying or breaking, reducing rework risks.
4. Oxidation-resistant and corrosion-resistant surface treatment-resists rust, leaves pads clean and smooth with minimal residue after soldering.
5. Ultra-thin flat spool design-compact, space-saving, and easy to store.
6. RoHS compliant, safe and reliable for precision electronics repair.
7. Precision Width (2.0mm). Ideal for smartphone motherboard and BGA pad desoldering.
8 Multiple Length Options. Available in 1.5m, 2.0m, and 2.3m lengths to suit different repair needs.
Product Parameters:
Brand: JCID
Material: High-purity oxygen-free copper
Braid Structure: High-density seamless braid
Surface Treatment: Oxidation-resistant and corrosion-resistant coating
Spool Diameter: Approx. 46mm
Features: Low residue, RoHS compliant
Application Processes: Desoldering, pad cleaning, pre-tinning/reballing preparation
