JCID SMT-01 Middle-Layer Reballing Platform with magnetic base and stencils for the intricate task of reballing and tin plating the middle layer of iPhone motherboards. Engineered for the iPhone X-17 Pro Max series. Ideal for professional micro-soldering technicians looking to achieve flawless middle-layer separation and reballing.
Features:
1. Stackable Expandable Base Design: Utilizes a universal base with modular stackable plates. It supports continuously updated models with endless expansion without requiring base replacement, saving repair costs and workspace.
2. High-Strength Magnetic Positioning: The base features strong magnetism, enabling automatic alignment and secure magnetic holding of chips and stencils to prevent displacement.
3. High-Precision Alignment: Manufactured with high-precision equipment for exact fitting and minimal deviation, reducing repeated adjustments and improving repair efficiency.
4. Heat-Resistant Eco-Friendly Material: The middle-layer alignment plate is made of premium synthetic stone, offering excellent heat resistance, high strength, stain resistance, and easy cleaning.
5. Premium Precision Stencils: Made of premium steel (0.12mm thickness) with precision craftsmanship, offering excellent wear resistance and toughness for stable and accurate reballing.
6. Wide Compatibility for Full Series: One toolset comprehensively covers the middle-layer reballing needs for iPhone X to 17 series (including Pro, Pro Max, Plus, Mini, Air, and other sub-models).
Product Parameters:
Brand: JCID
Product Name: Middle-Layer Reballing Station
Model: SMT-01
Function: Magnetic/Assisted Positioning/Stackable Expansion
Product Dimensions: 14mm × 62mm × 104mm
Package Dimensions: 68mm × 53mm × 112mm
Net Weight: 151g
Gross Weight: 462g
Compatible Models: iPhone X/11/12/13/14/15/16/17 Series
Stencil Thickness: 0.12mm
