JCID SMT-02 CPU Reballing Kit includes Magnetic BGA Positioning Platform with 79 Stencils for Apple iPhone and Android BGA CPU soldering repair. Features a magnetic precision positioning platform, 79 high-quality 301 stainless steel stencils for a vast array of CPU models including Apple, Qualcomm (Snapdragon), MediaTek (Dimensity/Helio), Samsung (Exynos), HiSilicon (Kirin), and EMMC memory chips.
Features:
1. Adopts an innovative magnetic positioning system to achieve automatic precision positioning of chips. The magnetic clamping is flexible and easy to adjust, ensuring secure and stable holding without displacement.
2. The base is made of eco-friendly synthetic stone material, featuring excellent heat resistance and a stain-resistant surface that is easy to clean, suitable for high-frequency repair use.
3. Equipped with special 301 stainless steel stencils with excellent toughness and bend resistance. It remains flat under repeated heating and effectively resists bulging and deformation.
4. Comprehensive Stencil Library (79 PCS). Includes a massive collection of high-quality stencils covering Apple (A10-A19 Pro), Qualcomm (Snapdragon series), MediaTek (MTK series), Samsung (Exynos), HiSilicon (Kirin), and EMMC/Upper layer BGA.
5. Provides dedicated stencils for different chip upper layers and font libraries (EMMC/UFS), meeting various complex chip-level repair requirements.
Option:
SMT-02 Standard Kit, includes the magnetic reballing base and a full set of 79 stencils (divided into the following 6 series):
· Exynos CPU Stencil × 12PCS
· Apple CPU Stencil × 12PCS
· MediaTek CPU Stencil × 15PCS
· Qualcomm CPU Stencil × 19PCS
· Kirin CPU Stencil × 9PCS
· Upper layer/EMMC CPU Stencil × 12PCS
Product Parameters:
Brand: JCID
Product Name: CPU & BGA Reballing Platform Kit
Model: SMT-02
Function: Magnetic / Assisted Positioning
Product Dimensions: 55mm × 55mm × 13mm
Package Dimensions: 65mm × 65mm × 35mm
Net Weight: 69g
Gross Weight: 124g
Supported Models: 79 CPU models
