JTXTOOLS T4MAX Glue Removal & Reballing Platform with 17 precision stencils for efficient glue removal and precise tin planting on CPU, EMMC, and RAM chips. Supporting 102 chip models across Apple iPhone, Android, Exynos, Qualcomm, HiSilicon, and Dimensity processors. A powerful magnetic force firmly secures the chip, automatically clamping and aligning it for precise chip placement. It is an essential tool for mobile phone repair technicians performing chip-level rework and micro-soldering.
Features:
1. Supports soldering needs for various chips including Apple CPUs, EMMC, RAM, and Android chips from Qualcomm, Exynos, HiSilicon, and Dimensity.
2. Integrates glue removal, positioning, and soldering functions, reducing equipment investment and improving repair efficiency.
3. Employs a magnetic positioning structure for automatic alignment and secure chip fixation, reducing the risk of operational misalignment.
4. High-precision 3D stencils help achieve more uniform solder ball formation, improving soldering quality.
5. Dedicated adhesive removal and positioning structure assists in removing residual adhesive, reducing chip damage.
6. Upgraded 17 types of solder mesh to meet the repair needs of different CPU, RAM, and memory chip models.
7. Processed from aerospace-grade aluminum, featuring high strength, wear resistance, and long-term stable use.
8. Constructed from selected high-toughness steel, wear-resistant and durable, ensuring long-term precision.
9. Equipped with rubber feet, providing anti-slip, shock absorption, aging resistance, and high-temperature resistance.
Product Parameters
Brand: JTXTOOLS
English Name: T4 MAX Glue Removal & Reballing Platform
Product Application: Chip positioning, glue removal, and soldering
Supported Chip Types: CPU / EMMC / RAM
Compatible Platforms: Apple / Android
Supported Chip Quantity: 102 chip models
Solder Reballing Mesh Quantity: 17 models
Product Material: Aviation Aluminum
Steel Mesh Material: High-quality steel
Product Dimensions: 120x59x15mm
Positioning Method: Magnetic automatic positioning clamping
Design Structure: Two-in-one glue removal and soldering design
Supported Models for Soldering Mesh
· Apple Series: Apple CPU, Apple EMMC, Apple RAM
· Android Series:
Qualcomm Series: Qualcomm 01-06
Exynos Series: Exynos 01-02
HiSilicon Series: HiSilicon 01-02
Dimensity Series: Dimensity 01-02
Android RAM Universal Soldering Mesh
