Kaisi 2D Middle-level BGA Reballing Stencil Kits For HUAWEI Motherboard Mate 30/Nova6/P40/P30/V30pro 2D Reballing Stencil Square Hole Steel Mesh
0.12MM Kaisi 2D middle network BGA Reballing Stencil For HUAWEI Motherboard Mate 30/Nova6/P40/P30/V30pro series mid-layer network,Kaisi Easy Repair Mid-Layer Net Motherboard Mid-level Tin Planting Net/Middle-level Steel Net.
Model : Kaisi 2D BGA Reballing Stencil
Particle Size: 1-10μm
model: For HUAWEI Motherboard
application: HUAWEI BGA Reballing Stencil
application 2: Square hole steel mesh
Features :
100% brand new and high quality.
Made of premium metal material, these stencils are durable.
This is a set of different stencils mainly used for iPhone BGA reballing.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Compatible with: Special for Huawei Mate 30/Nova6/P40/P30/V30pro
Package included :
1pcs x BGA Stencils reballing
Skip to content