High Viscosity NC-559-ASM / RMA-223-UV / KINGBO RMA-218 / ALPHA OM-5300 No-Clean Soldering Paste Flux BGA Soldering Tin Cream for Phone PCB BGA Soldering Repair.
Options:
Option 1: Hanwuyou NC-559-ASM 10cc - Made in China.
Option 2: Hanwuyou RMA-223 100g -UV - Made in China.
Option 3: KINGBO RMA-218 100g.
Option 4: KINGBO RMA-218 10CC.
Option 5: ALPHA OM-5300 Solder Paste.
Features:
- The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.
- Good formula for BGA reballing / balls works it can stick the balls much more.
Note: solder paste can only can be sent out by special mail post.
Package includes:
- 1pc x BGA Solder Paste Flux
