LANRUI CT60/CT80 Active Solder Balls for Reballing Solder Joints on iPhone/Android Phone Motherboard PCB Pads. LANRUI CT60 CT80 Active Ball 25K solder tin balls for mobile phone IC Chip BGA rework repair without soldering jumper wire.
Option:
1. Lanrui CT80: For Android (Android patch)
2. Lanrui CT60: For Apple (Apple/IP patch)
Please note: Solder balls can only be shipped via a special economy shipping method.
Features:
1. High-yield production: Strictly controlled ball diameter tolerance, only 8 micrometers, far below the industry standard of 10-25 micrometers, ensuring soldering quality.
2. Physical properties: Static-free, small allowance, high yield, suitable for precision soldering needs.
3. Ease of use: Only one active bead is needed for each soldering repair, simplifying operation and improving efficiency.
4. Wide Applicability: CT80 is suitable for Android devices, and CT60 is suitable for Apple devices, meeting the motherboard repair needs of different brands.
Product Parameters:
Name: Fill Active Beads Solder Balls Soldering Wire
Model:
· CT80: For Android (Android patch)
· CT60: For Apple (Apple/IP patch)
Quantity: 25000 PCS/bottle
Use: For motherboard solder pad repair points
