MECHANIC MagTin Max is a professional-grade dual-sided magnetic BGA reballing platform with BGA stencils designed for Apple iPhone and Android like Qualcomm, MTK, Exynos, Hisilicon chips. Heat-resistant, precise alignment for BGA reballing. Featuring a strong magnetic dual-sided base, it securely holds chips and stencils in place during BGA reballing, eliminating gaps where solder paste could seep in and ensuring uniform ball placement. Ideal for CPU, NAND, and IC reballing.
Features:
1. The dual-sided magnetic design features Side A dedicated to Apple chips (0.6mm thickness) and Side B for Android chips (0.35mm thickness), supporting a wide range of mainstream chip reballing needs with a single tool.
2. Flipping the platform immediately starts the next chip reballing operation without the need for base replacement or repositioning, simplifying workflow and significantly boosting efficiency.
3. Magnetic attraction technology enables automatic stencil alignment and locking in one step, with every “click” ensuring precise positioning for consistent soldering quality.
4. The groove structure design effectively enhances heat dissipation, keeping the platform cool, quiet, and stable during operation to prevent positioning drift caused by heat buildup.
5. The stencil library is continuously updated in real time, with 90 precision steel stencils covering Apple (A10–A19 Pro), Qualcomm (Snapdragon 8/7/6 series), MediaTek (Dimensity series), Exynos, HiSilicon (Kirin), and EMMC/RAM chips
CPU stencil models (90pcs):
1. Qualcomm (21pcs):
SM8750
SM8450
SM8150
SM7325
SM7125
SM8650
SM8350
SM7550
SM7250
SM7750
SM6450/SM7435
SM8550
SM7150
SM7450
SM8475/SM7475
SM8250-102
SM7350
SM8250-002
SM7225-00AB
SM8850
SM8735
2. iPhone (12pcs):
A19 PRO
A19
A18 PRO
A18
A17
A16
A15
A14
A13
A12
A11
A10
3. Hisilicon (12pcs):
Hi36C0
Hi3690-5G
Hi6280
Hi36A0
Hi3670
HI36D0
Hi36A0
Hi3690-4G
Hi3680
Hi6290/L
HI6290
HI62B0
4. MTK (21pcs):
MT6989W
MT6895Z
MT6855V
MT6853V
MT6983Z
MT6885Z
MT6873V/6875V
MT6891Z/6893Z
MT6878V
MT6899Z
MT6991Z
MT6985W
MT6897Z
MT6877V
MT8781/MT6789V
MT6761V/6762V/6765
MT6833V
MT6886V
MT6781V
MT6835V
MT6993Z
5. Exynos (12pcs):
Exynos 2200
Exynos 9820
Exynos 8895
Exynos 2100
Exynos 980
Exynos 990
Exynos 1330-E8535P
Exynos 1380-E8835P
Exynos 1480-E8845
Exynos 1280-E8825
Exynos 9815/1080
Exynos2400-E9945
6. EMMC+RAM (12pcs):
BGA 254
BGA 169
BGA 134
BGA 436
BGA 178
BGA 153
BGA 186
BGA 162
BGA 556
BGA 376
BGA 496
BGA 221
Product Parameters:
Brand: MECHANIC
Product Name: Dual-Sided Magnetic Reballing Platform
Model: MagTin Max 2.0
Product Dimensions: 55mm × 73mm × 11mm
Package Dimensions: 65mm × 37mm × 78mm
Net Weight: 79g
Gross Weight: 290g
Stencils Included: 90 pieces
Side A Compatibility: Apple Chips (0.6mm)
Side B Compatibility: Android Chips (0.35mm)
Compatible Chips: MT69937, Tianyu 9500, A19, A19 Pro, SM8735, Snapdragon 8s Elite, HiSilicon X9, and more
Note: Product shown is a rendered effect with manual measurements; actual product may vary.
