Mechanic 3D stencil for iPhone X motherboard middle layer soldering repair. Mechanic 3D-X-PRO middle layer stencil with positioning base for iPhone X motherboard repair. Mechanic 3D Square Hole BGA Reballing Stencil steel mesh middle layer positioning tool for iPhone X A12.
Option:1. 3D-X stencil only: for iPhone X.
2. 3D-X Pro stencil with base: for iPhone X
Description:Mechanic 3D BGA Reballing Stencil for iPhone X Motherboard Middle Layer, iPhone X A12 PCB groove Reballing Stencil Template, New patented iPhone X Middle Layer Motherboard 3D BGA Reballing Stencil template, used for assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.Features"
- Made of high temperature resistant synthetic stone
- 0.3mm thickness, easy to scrape tin, high strength, not easy to deform
- Durable, easier to take off the net, more efficient
- Mini size, can put under microscope for use,easy to observe
- 3D Design,stable use, precise plate tin
