MECHANIC IX50 preheating platform designed for iPhone 11-17 Pro Max motherboard layering, PCB preheating, BGA reballing, and chip glue removal. 40-260°C temperature range, digital display, 3 memory presets, and iPhone X-17 hollow module compatibility. Ensures reliable, repeatable preheating for professional phone and electronics repair. Ideal for PCB preheating, BGA reballing, and chip repair.
Features:
1. The adjustable temperature range of 40 to 260℃ covers preheating requirements for various repair processes, including tin planting, desoldering, and glue removal, offering broad applicability.
2. The built-in digital temperature display provides real-time temperature monitoring, allowing technicians to stay fully informed of the current temperature status for precise control.
3. Temperature memory storage saves commonly used settings for quick recall after power-on, eliminating repetitive setup and improving workflow efficiency.
4. The integrated function and power key, combined with dedicated up/down adjustment buttons, delivers a clear and user-friendly operating experience.
5. Compatibility with iPhone 11-17 series phone motherboard modules ensures versatile adaptability across different mainstream models for a wide range of applications.
6. With intelligent Buzzer Alert, Audible reminder when target temperature is reached.
7. Precise positioning, accurate alignment for motherboard layering and chip work.
8. 62W power output , efficient heating with fast temperature recovery.
Product Parameters:
Brand: MECHANIC
Product Name: Preheating Platform
Model: IX50
Power: 62W
Temperature Range: 40~260℃
Product Dimensions: 108mm × 120mm × 28mm
Net Weight: 247.5g
Package Dimensions: 150mm × 140mm × 64mm
Gross Weight: 482.9g
Adapter: 110V-240V
Display: Digital Temperature Display
Compatible Modules: Supports 11-17 series iPhone motherboard modules
Note: Product shown is a rendered effect with manual measurements; actual product may vary.
