MECHANIC Magic-Tag 3 Solder Piece available in 0.28mm and 0.3mm diameter for quick spot welding repair on Apple iPhone and Android Phone motherboards. Magic Tag solder piece replaces traditional jumper wire looping methods, allowing technicians to restore missing or damaged pads without leaving a trace. Ultra-thin, industrial-grade copper foil material; enables highly efficient, seamless, and rapid localized repair of middle layer bonding on Apple and Android motherboards.
Option (diameter/thickness):
1. 0.28x0.08mm.
2. 0.30x0.10mm.
Features
1. Seamless Repair Technology: Achieves mid-layer solder pad patching without jumper wires, resulting in near-factory quality.
2. Rapid Patch Process: Suitable for repairing mid-layer breaks and solder pads on motherboards, improving repair efficiency.
3. Dual Size Design: Available in 0.28mm (0.08mm thick) and 0.3mm (0.1mm thick) sizes to suit different repair needs.
4. High-quality phosphor bronze material: Low conductivity loss, high efficiency, and strong fatigue resistance.
5. Standard size design: Uniform sheet specifications facilitate batch processing and repair.
6. Professional-grade repair solution: Replaces traditional flying wire methods, improving stability and reliability.
Product Specifications:
Brand: MECHANIC
Product Name: MagicTag 3 Solder Piece for Repair Welding
Model: Magic Tag 3
Product Size: 57x85 mm
Material: High-quality Phosphor Bronze
Specification 1: 0.28Φx0.08mm
Specification 2: 0.30Φx0.10mm
Quantity: Approx. 1850 pcs
Function: Invisible Repair/Quick Spot Repair
