Mechanic MagTin X Magnetic Levitation CPU Degumming and Tinning 2-In-1 Platform for iPhone 7-17 Pro Max A10/A11/A12/A13/A14/A15/A16/A17/A18/A19 Pro CPU, Huawei HiSilicon CPU and Qualcomm Snapdragon CPU black glue removal and tin planting repair. High temperature resistant stone and steel stencil for bright and full soldering joints.
Features:
1. Magnetic levitation CPU degumming and tinning platform used with Mechanic CPU degumming liquid + brush, quickly removes CPU chip black glue, safe and without dropping points.
2. The built-in magnets in the platform have a strong adsorption force, making the slider automatically clamped and accurately aligned under the action of the magnetic field.
3. Chip tinning steel stencil design is unique, and ensures that each solder joint is accurately placed in the predetermined position, the solder joints are firm and reliable, no false soldering phenomenon, which are bright and rounded.
4. Fully General-Purpose Various BGA chips, support iPhone/Huawei/Qualcomm series various CPU chips, corresponding to different chip stencil repair.
5. Synthetic stone made of nano-composite materials, It has an excellent high temperature resistance, the unique material can withstand temperatures up to 500°C，effectively prevent static interference and corrosion, wear-resistant properties.
Specifications:
Name: Magnetic MagTin X CPU degumming and tinning platform.
Application: Universal iPhone and Android Phones all models of CPU de-gumming and tin planting.
Size: 143×55×16mm.
Net Weight: 234g.
Packing Size: 173×85×26mm.
Gross Weight: 304g.
