Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair - CHINA PHONEFIX

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Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair

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PHONEFIXSKU: VC505

Option: UV50(40g)

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$1.55 USD $2.55 USD

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MECHANIC High Synthetic BGA Solder Flux Paste Advanced Soldering Paste Flux BGA Soldering Tin Cream for Mobile Phone Motherboard PCB, BGA, SMD Repair.

Option Model:

Option 1: Mechanic UV50 flux paste 40G.
Option 2: Mechanic UV80 flux paste 60G.

Features:

High bond strength. PH value neutral, insulation is strong, welding surface smooth
IC and PCB for no corrosive
Its boiling point only slightly higher than the melting point of the solder
For mobile phones, PC cards, BGA, SMD, PGA and other sophisticated electronic chip-level help welding

Specifications:

Brand: MECHANIC
Item name: Soldering paste flux
Model: UV50 / UV80
Color: Yellow
Viscosity: 0.2PaS
Granularity: 0.22um
Packing: Aluminum box
Appliance: PCB, BGA, SMD, PGA repair repair

Instructions:

Wipe the surface of the object before soldering.
Apply the paste flux to the solder joint.
Solder the tin to the solder joint with soldering iron.

Package includes:

1pc x MECHANIC Soldering Paste Flux

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Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair

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Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair

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