MECHANIC DW50 ZC50 LW50 GW50 CPG90 Solder Paste 138/158/183/199/217℃ soldering tin flux paste for mobile phone and electronic IC motherboard PCB and small components welding repair.
Option:
1. Mechanic ZW50 183℃ Solder Paste: for chip tin planting.
2. Mechanic ZC50 158℃ solder paste: for phone motherboard middle layer reballing.
3. Mechanic LW50 138℃ solder paste: for phone motherboard middle layer reballing.
4. Mechanic GW50 217℃ solder paste: for CPU reballing repair.
5. Mechanic CPG90 Beta 199℃ solder paste: for Android CPU reballing repair.
Please note: the solder paste flux can only be sent out by special way (economy shipping).
Features:
- This series of solder paste is customized and developed for high-precision maintenance. The solder paste has moderate humidity, is not easy to agglomerate, easy to tin, and has no false soldering.
- The new formula is durable to storage, and its anti-oxidation performance is at least 2 times higher than that of similar solder pastes. The high-quality solder paste is even and delicate.
- No False Soldering / Less Residue / Bright Solder Joints / Strong Tin Climbing / Good Conductivity / Oxidation Resistance / Non-Corrosion PCB / No-Cleaning
Package:
1* 50g Solder Paste
