MECHANIC XGZ40 10CC 183°C Solder Paste for Mobile Phone PCB repair, SMD/BGA reworking, and chip reballing. Mechanic XG-Z40 is a high-viscosity and no-clean solder paste tin cream, Sn63/Pb37, ideal for mobile phone and computer motherboard repairs due to its precision and reliability.
Features:
- The BGA flux solder paste is a high viscosity no-clean flux.
- It is the mixture of high-quality alloyed powder and resin paste flux.
- It can avoid the pale yellow residue, so you are easy to clean the board.
- It can be used for PCB, BGA, SMD, PGA reworking.
- It can be used for soldering and reballing of computer and phone chips.
- It is a necessary material for repairing the mobile phone mainboard.
- Help to repair the circuit boards and protect the electronic components.
- The solder paste flux can only be sent out by special post mail.
Specification:
- Item name: Solder Paste Flux
- Brand: MECHANIC
- Type: XG-Z40
- Material: Tin+solder paste
- Color: As picture shown
- Alloy: Sn63/Pb37
- Microns: 25-45um
- Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm
Package includes:
- 1pc x MECHANIC BGA Solder Flux
