MiJing lead-free tin paste 138A 158A 217A 190A low/medium/high temperature solder flux paste for mobile phone motherboard CPU IC BGA SMD chips soldering repair.
Option:
1. MIJING 138℃ High Purity Tin Paste 50g.
2. MIJING 158℃ High Purity Tin Paste 50g.
3. MIJING 183℃ High Purity Tin Paste 50g.
4. MIJING 199℃ High Purity Tin Paste 50g.
Features:
1. Small size, light weight, easy to carry and store, can be used for a long time.
2. The welding tin paste is very convenient to use, and it can be used many times.
3. Advanced insulation technology, high viscosity no-clean flux, can be used for PCB, SMD rework, and ball placement of computer and mobile phone chips.
4. Excellent welding performance, bright solder joints, strong conductivity, and increased silver particles.
5. Fine and viscous, high purity, no foaming, not easy to oxidize, uniform welding beads, strong welding.
Product parameters:
Brand: MiJing.
Model Number: MiJing 138A 158A 217A 190A.
Particle Size: 1-10μm.
