Mijing CH5 Intelligent motherboard preheating layered desoldering platform with CH5 CH5-BC CH5-E mold for iPhone X-12 Pro Max motherboard disassembly. Mijing CH5 motherboard heating separating welding platform for iPhone 12/11/X series PCB mainboard layering.
1. Preheating platform for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12mini/12 Pro/12 Pro Max motherboard layering, support CPU chip, HHD Nand flash, Baseband, glue removal.
2. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.
Option:
1. MIJING CH5 host.
2. CH5 X/XS/XS MAX 3 in 1 groove.
3. CH5 B/C groove 3 in 1 for iPhone 11/11 Pro/11 Pro Max.
4. CH5 E groove 4 in 1 for iPhone 12/12 mini/12 Pro/12 Pro Max.
MIJING CH5 Main Unit:
- Product Size: 159 mm*89mm*48mm
- Material: Aluminum alloy
- Input voltage: 110V~220V
- Output voltage: 24V
Extended Heating Station:
- Product Size: 164mm*92mm*40mm
- Color: Grey + Blue
- Material: Aluminum alloy
- Double male adapter cable: 1m
- Power cable: 1m
- Max temperature: 300℃
- Min temperature: 100℃
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