MIJING MS1-MINI Chip Glue Removal Table for heating and removing glue from mobile phone CPU RAM, NAND, eMMC, SSD, WIFI, and BGA chips without using hot air gun and soldering iron. Mijing MS1-MINI glue removal desoldering station, rapid heating, one-button adjustment, easy and simple operation.
Features:
Rapid Heating: Adjustable temperature range (160°C–250°C) for precise control.
Efficient Heat Conduction: Aluminum substrate ensures fast and even heating.
Low Voltage Operation: Supports 5V/9V power supply for safety and energy efficiency.
Compact & Portable: Lightweight design, easy to carry and operate.
Versatile Usage: Suitable for removing glue and tin from CPU, RAM, eMMC, SSD, WIFI chips, and more.
User-Friendly Design: Full-fit surface and concealed screws for seamless operation.
Product Parameters:
Model: MIJING MS1-MINI chip glue removal table.
Weight: 126g
Size: 105mm × 80mm × 22mm
Function: Adjustable temperature, constant temperature heating, rapid heating
