MIJING Z21 MAX CPU reballing stencil platform for iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 Pro CPU Android Huawei Qualcomm, ect. MJ Z21 MAX iPhone/Android CPU chip tin-planting steel mesh for iPhone 6-16 Pro Max Android Phones CPU repair.
Features:
- High-temperature resistance and abrasion resistance
- Imported alloy steel, metal fatigue resistance, make the product use more durable
- Imported alloy steel, high material, and technology, dirt-resistant, easy to clean.
- High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints
- The square holes and rounded corners are planted with tin and black nets to make each of your tin balls more rounded and fuller.
- Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
- High precision, no burrs, so that every mesh can be of the same size and not stuck
- Double magnet, super magnetic, accurate positioning without shaking
Applicable Model:
1. For iPhone 6-16 Pro Max CPU (A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 Pro CPU).
2. For Huawei HI3670, Huawei HI3680, HiSilicon HI3690, HiSilicon HI3690 5G, HiSilicon HI6290/L, SM8250-102 small, SM8250-202 large, Qualcomm SM8350/Snapdragon 888, Snapdragon 845/SDM845, Snapdragon 855/SM8150, Kirin 9000 HI36A0, EMMC/EMCP/UFS BGA153, SM8350/8450, Exynos9610/9611RAM, SM8475, HI6280, SM7250, SM7325, HI6260 V100, HI6260 V101, SM8650, MT6989W.
