MobiTool MT-11 transparent lead-free solder flux is used for repairing mobile phone motherboard CPU chips, FPC connectors, etc. Syringe-style design for easy operation and precise dosage. It has excellent flowability and adhesion, and its halogen-free formula ensures bright and strong solder joints, making motherboard repairs more reliable. No residue, no cleaning required, suitable for mobile phone CPU soldering and repair, BGA chip soldering, desoldering and rework.
Features:
1. Easy Soldering with No Bridging: Clear and bright solder joints effectively prevent solder bridging.
2. High Adhesion: Strong flowability and strong component fixation, with extremely high drop resistance.
3. Excellent Insulation: High insulation resistance, non-corrosive, ensuring circuit safety.
4. RoHS Compliant, Lead-Free and Halogen-Free.
5. Low Smoke and Odorless: Significantly reduces smoke and odor during soldering, protecting operator health.
6. Syringe-Style Packaging: Plug and play, precise dosage control, eliminating waste.
7. No-clean process: There are very few and transparent residues after welding, so no secondary cleaning is required, and it does not affect the appearance or performance.
