Mr. Yang High-Precision IC Adhesive Removal Blade is designed for safely and efficiently removing stubborn black adhesive from beneath CPU and IC chips on mobile phone motherboards. This scraper blade is made from imported PI (polyimide) material, and 45-degree angled design, it softens slightly when heated, allowing it to conform closely to the chip surface for precise and efficient adhesive residue removal. Its detachable blade design facilitates easy replacement and effectively prevents damage to IC chips and PCB pads during the process. The ultra-thin tip easily reaches beneath the chip to clear away residue, making it an indispensable tool for chip repair, rework, and motherboard maintenance.
Option:
1. M.Y glue removal blade with handle set.
2. M.Y glue removal blade only.
Features:
1. Made of imported PI material with high temperature resistance. When heated, the material softens and becomes more flexible, allowing it to conform closely to chip surfaces for efficient removal of stubborn black adhesive.
2. The thin blade design easily inserts under chips for convenient residual adhesive cleaning, avoiding pad peeling or circuit scratches that are common risks with traditional metal tools.
3. The removable blade head is flexible to use and removes adhesive without damaging IC chips, effectively protecting PCB pads.
4. Specifically designed for stubborn black adhesive removal, suitable for cleaning residual adhesive beneath chips to improve repair success rates.
5. The ergonomic handle provides a comfortable grip, reducing fatigue during extended use while offering precise control.
Product Parameters:
Brand: Mr.Yang
Product Name: High-Precision IC Adhesive Removal Blade
Material: Imported PI
Single Blade Length: 27mm
Total Length (Handle+Blade): 163mm
