YCS Mr. Yang M.Y IC chip degumming station is a professional dual-workstation tool designed for efficient glue removal and pin repair on BGA chips, CPUs, memory ICs, and power management ICs. Equipped with 0.2mm/0.4mm limiting thicknesses, it utilizes a tempered glass panel with a metal base, offering high temperature resistance, easy cleaning, and durability. It is suitable for repairing various chips such as CPUs, BGAs, memory ICs, and other chips from iPhones, Android devices, and more.
Feature:
1. Dual working area design allows for simultaneous processing of different chips, improving repair efficiency.
2. Knob-type stepless adjustment structure allows for precise adjustment of the clamping width, compatible with IC chips of different sizes.
3. Securely fixes the chip, preventing movement during repair and improving the accuracy of glue removal and repair.
4. Built-in dual limiting thicknesses effectively protect chip pads and pins, reducing repair risks. 5. High temperature resistant, easy to clean, and does not easily leave adhesive residue, suitable for long-term maintenance use.
6. Robust and stable overall structure, wear-resistant and durable, suitable for high-frequency maintenance environments.
7. Applicable to the repair of various chips such as CPUs, BGAs, memory ICs, and power management ICs in iPhone, Android, and other devices.
Product Parameters:
Product Name: IC Chip Degumming Station
Brand: M.Y MR.YANG
Material: Tempered glass panel + metal base
Working Stations: Dual stations
Limit Thickness: 0.2mm / 0.4mm
Adjustment Method: Stepless knob adjustment
Product Dimensions: 64x50x19 mm
Packaging Dimensions: 75x32x110 mm
Packaging Weight: Approx. 114g
