Multifunctional positioning pressure reducing silicone mat for iPhone BGA CPU IC soldering repair. Hong Hai Tong silicon magic pad for protecting BGA chips when reballing. 115x97mm positioning pressure reducing silicone protective pad for cellphone BGA IC fingerprint camera Face ID soldering repair.
Features:
1. Specially designed for BGA CPU chips reballing.
2. CPU planting tin, dynamic leveling of planting tin net, protecting chip more securely.
3. Replace the iPhone fingerprint flex cable, front camera and infrared camera cable, Face ID dot matrix flex cable.
4. Avoid tin messing caused by the deformation of steel mesh efficiently.
5. Size: 115*97mm.
