QianLi F1X Intelligent Curve Heating Platform is an desoldering station designed for professional phone motherboard repair. With the Hollow heating mold for iPhone X-17 Pro Max. Smart curve temperature control that aligns heating, holding, and cooling with your workflow. 60-280°C range, and 60x90mm heating area. adjustable multi-directional clamps securely hold motherboards of various sizes, while the intuitive color LCD display and control dial provide real-time temperature monitoring and one-touch mode switching. Supports iPhone X/11/12/13/14/15/16/17 Pro Max and Android motherboards.
Features:
1. Supports a three-stage temperature control process: rapid heating, stable constant temperature, and safe cooling, making the desoldering process more controllable.
2. A large heating area covers the repair needs of mainstream mobile phone motherboards, improving overall heating efficiency.
3. Supports a wide temperature range of 60℃-280℃ adjustment to meet different temperature requirements for preheating, repair, and desoldering.
4. A spring-loaded fixing structure combined with a sliding groove design allows for quick fixing of motherboards of different sizes, reducing movement during the repair process.
5. Dedicated modules designed for different iPhone models achieve precise mid-layer heating, reducing the risk of solder bursting and motherboard damage.
6. The screen clearly displays temperature, mode, and operating status, improving operational efficiency.
7. Supports preset temperatures of 60℃, 180℃, and 280℃, and allows for quick switching to maintenance modes.
8. Integrates the heating platform, control system, and mounting structure, reducing equipment space requirements.
Option:
1. X/XS/XSMax Mold
2. 11 Mould
3. 11Pro/11PM Mold
4. 12/12Pro Mold
5. 12Mini Mold
6. 12PM Mold
7. 13 Mould
8. 13Mini Mold
9. 13PM Mold
10. 13Pro Mold
11. 14/14Plus Mold
12. 14Pro/PM Mold
13. 15/15Plus Mold
14. 15Pro/PM Mold
15. 16/16Plus Mold
16. 16Pro/16PM Mold
17. 17/17AirMould
18. 17Pro/17PM Mold
19. F1X Host
20. F1X Host+(X~17PM) Mold Set
21. IP X~17PM Mould Set
Product Parameters
Brand: QIANLI
Product Name: F1X Integrated Intelligent Desoldering Platform
Product Model: F1X
Input Voltage: 110V/220V (Not Universal)
Temperature Control Range: 60℃-280℃
Heating Module Material: Aluminum Alloy
Main Board Mounting Claw Material: Synthetic Stone
Heating Area Size: 60×90mm
Net Weight: 338g
Gross Weight: 492g
Product Dimensions: 115×134×54mm
Packaging Dimensions: 192×151×62mm
Interface: PC-Type-C Interface
Control Method: LCD Screen + Knob Control
Heating Mode: Standard Curve Mode / Wave Soldering Curve Mode
