QIANLI Super Cam X 9mm Infrared Thermal Imaging System supports real-time thermal distribution imaging, 3D thermal field visualization analysis, and PCBA quick lookup functions, enabling rapid location of motherboard leakage and abnormal heat points. It achieves high-precision temperature imaging through a high-sensitivity VOx infrared detector, eliminating the need for a visible light camera. Suitable for complex electronic repair, R&D testing, and professional thermal analysis scenarios.
Features:
1. 9mm high magnification: Enhanced magnification capability, suitable for fine-tuning.
2. Quickly scans motherboard thermal anomalies, accurately locating leakage and fault areas, significantly improving repair efficiency.
3. Employs VOx infrared detection technology, supporting a temperature range of -20℃ to 120℃, with sensitive and stable temperature response.
4. Innovative 3D thermal distribution mode, allowing for rotating observation of heat spatial distribution, enhancing the ability to analyze complex structures.
5. Utilizes a high-precision infrared lens system, presenting clear thermal outlines without the need for a visible light camera.
6. Supports curve recording, temperature analysis, area marking, comparative analysis, and multi-tool temperature measurement functions.
Product Parameters
Brand: QIANLI
Product Name: Super Cam X Infrared Thermal Imaging System
Model: Super Cam X 9mm
Temperature Range: -20℃ ~ 120℃
Storage Temperature: -15℃ ~ +60℃
Input Voltage: 5V DC
Resolution (Temperature Points): 110,592/52,000 (depending on version)
Lens Type: VOx Infrared Detector
Field of View: 42°x32°
Band Range: 7–14μm
Structural Dimensions: Base 150x160mm
Stand Height: 161.5mm
Packaging Dimensions: 180x180x59mm
Weight: 439.4g
