RELIFE RL-400 RL-401 RL-402 RL-403 RL-403S 183°C Sn63/Pb67 Solder Paste for Mobile Phone Motherboard BGA Chips Reballing and Repair. RELIFE 183°C medium temperature No-clean soldering paste for electronics BGA PCB SMT reballing welding repair.
Option:
1. RELIFE RL-400 183℃ Solder Paste 20g.
2. RELIFE RL-401 183℃ Solder Paste 30g.
3. RELIFE RL-402 183℃ Solder Paste 40g.
4. RELIFE RL-403 183℃ Solder Paste 10CC.
5. RELIFE RL-403S 183℃ Solder Paste 10CC with syringe.
Note: solder paste can only be sent out by special post mail.
Features:
- 183°C Solder paste with high quality
- The solder core is very strong
- Less residual
- No-Clean
- Unique manufacturing of solder past technology, giving a new definition of tin-base technology
